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Faculty

Wang Fei


Associate Professor

Department of Electrical and Electronic Engineering

0755-88018509

wangf@sustc.edu.cn

Research Interests:

◆Semiconductor Processing and Micro-/Nano Fabrication

◆Micro-Electro-Mechanical System (MEMS), NEMS

◆IC test and Semiconductor material test

◆Optic fiber sensors

◆Energy harvesting

Professional Experience:

◆ 2010 - 2013 Assistant Professor

Department of Micro- and Nanotechnology (DTU Nanotech), DTU

◆ 2008 - 2010 Postdoctoral Researcher

Department of Micro- and Nanotechnology (DTU Nanotech), DTU 

Educational Background:

◆ Sept. 2003 - July 2008       Ph.D.

Shanghai Institute of Microsystem and Information Technology (SIMIT),

Chinese Academy of Sciences (CAS)

◆ Sept. 1999 - July 2003       B.E.

Department of Precision Machinery and Precision Instrumentation,

University of Science and Technology of China (USTC) 

Honors & Awards:

◆ 2013, Shenzhen “Overseas High-Caliber Personnel Award” (Peacock Plan, B-Class)

◆ 2012-, IEEE Senior Member

◆ 2008, CAS Zhu Li Yuehua Scholarship of Outstanding Doctoral Award

◆ 2007, Best Student Paper (1st of 450 papers) in 9th Annual Domestic Conference of China Society of Micro-Nano Technology, Shanghai.

Selected Publication:

ENERGY HARVESTING:                                                                                  

[J1] Andrea Crovetto, Fei Wang*, and Ole Hansen, “Electret based energy harvesting device with wafer level fabrication process,” Journal of Micromechanics and Microengineering, Volume 23, 114010 (10pp), 2013. 

[J2] Fei Wang, and Ole Hansen, “Invisible surface charge pattern on inorganic electrets,” IEEE Electron Device Letters, Volume 34, No. 8, 2013. 

[J3] Fei Wang, Christian Bertelsen, Gustav Skands, Thomas Pedersen, and Ole Hansen, “Reactive ion etching of polymer materials for energy harvesting devices,” Microelectronics Engineering, Volume 97, pp. 227–230, 2012.

[C1] Fei Wang, and Ole Hansen, “Electrostatic energy harvesting device with out-of-plane gap closing scheme,” in the 17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2013), June 16-20, 2013.

[C2] Andrea Crovetto, Fei Wang*, Marco Triches, and Ole Hansen, “MEMS fabricated energy harvesting device with 2D resonant structure,” in the 12th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2012), Oral Presentation, December 2-5, 2012.

[C3] Marco Triches, Fei Wang*, Andrea Crovetto, Anders Lei, Qiong You, Xiaoqing Zhang, and Ole Hansen, “A MEMS energy harvesting device for vibration with low acceleration,” in the 26th European conference on solid-state transducers (Eurosensors 2012), Oral Presentation, Sept. 9th-12th, 2012. 

[C4] Fei Wang, Christian Bertelsen, Gustav Skands, Thomas Pedersen, and Ole Hansen, “Reactive ion etching of polymer materials for energy harvesting devices,” in 37th International Conference on Micro and Nano Engineering (MNE2011), Oral Presentation, 19-23 Sept. 2011.

 

OPTIC FIBER SENSORS:

[J1] Fei Wang, Wu Yuan, Ole Hansen, and Ole Bang, “Selective filling of photonic crystal fibers using focused ion beam milled microchannels,” Optics Express, Vol. 19, Issue 18, pp. 17585–17590, 2011.

[J2] Wu Yuan, Fei Wang*, Alexey Savenko, Dirch Hjorth Petersen, and Ole Bang, “Optical fiber milled by focused ion beam and its application for Fabry-Pérot refractive index sensor,” Review of Scientific Instruments, 82, 076103 (3pp), 2011. 

[C1] Wu Yuan, Fei Wang, and Ole Bang, “Optical fiber sensors fabricated by the focused ion beam technique,” in the 22nd International Conference on Optical Fiber Sensors (OFS-22), Oct. 15-19 2012.

 

MICRO FOUR-POINT PROBES:

[J1] Daniel W. Koon, Fei Wang, Dirch Hjorth Petersen, and Ole Hansen, Sensitivity of resistive and Hall measurements to local inhomogeneities, Journal of Applied Physics, 114, 163710 (2013).

[J2] Fei Wang, Dirch H. Petersen, Helle Jensen, Christian Hansen, Dennis Mortensen, Lars Friis and Ole Hansen, “Three-way flexible cantilever probes for static contact,” Journal of Micromechanics and Microengineering, Volume 21, Issue 8, 085003 (8pp), 2011. (featured as the Cover Image) 

[J3] Fei Wang, Dirch H. Petersen, Torben M. Hansen, Toke Riishøj Henriksen, Peter Bøggild, and Ole Hansen, “Sensitivity study of micro four-point probe measurements on small samples,” Journal of Vacuum Science & Technology B (JVST B), Vol. 28, No. 1, pp. C1C34-C1C40, 2010. 

[J4] Sune Thorsteinsson, Fei Wang, Jang-Yong Kim, Dirch H. Petersen, Torben Mikael Hansen, Daniel Kjær, Rong Lin, Peter F. Nielsen, and Ole Hansen, “Accurate micro four-point probe sheet resistance measurements on small samples,” Review of Scientific Instruments, 80, 053902 (10pp), 2009. (featured as Monthly Top 20 Most Downloaded Paper) 

[C1] Dirch H. Petersen*, Fei Wang*, Mikkel B. Olesen, Rafal Wierzbicki, Michael S. Schmidt, Peter F. Nielsen, Peter Bøggild, Ole Hansen, and Kristian Mølhave, “Micro-cantilevers for non-destructive characterization of nanograss uniformity,” in 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011) pp. 1060-1063, 5-9 June 2011. 

[C2] Fei Wang, Dirch H. Petersen, Frederik W. Osterberg, and Ole Hansen, “Accuracy of micro four-point probe measurements on inhomogeneous samples: A probe spacing dependence study,” in 17th Annual IEEE International Conference on Advanced Thermal Processing of Semiconductors (RTP-2009), Oral Presentation, pp. 151-156, 29 Sept.-2 Oct., 2009. 

[P1] Fei Wang, Dirch Hjorth Petersen, Ole Hansen, Single-position hall effect measurements, WIPO Patent. (WO/2012/083955) 

 

MEMS PROBE CARDS:

[J1] Fei Wang, Rong Cheng, and Xinxin Li, “MEMS vertical probe cards with ultra densely arrayed metal probes for wafer-level IC testing,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 4, pp. 933-941, 2009. 

[J2] Fei Wang, Xinxin Li, and Songlin Feng, “Micro-cantilever probe cards with silicon and nickel composite micromachining technique for wafer-level burn-in testing”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 468-477, 2009. 

[J3] Fei Wang, Xinxin Li, and Songlin Feng, “A MEMS probe-card with 2-D dense-arrayed ‘hoe-shaped’ metal tips”, Journal of Micromechanics and Microengineering, Volume 18, Issue 5, 055008 (8pp), 2008. 

[C1] Fei Wang, Rong Cheng, and Xinxin Li, “MEMS vertical probe cards with both line-arrayed and area-arrayed ultra-dense metal tips for wafer-level IC testing,” in 2008 IEEE International Electron Devices Meeting (IEDM-2008), pp. 503-506, 15-17 Dec. 2008. 

[C2] Fei Wang, Xinxin Li, Songlin Feng, Tao Chen, Liguo Chen and Lining Sun, “Two-dimensional dense-arrayed probe-cards with a hoe-shaped probing-tip micromachining technique,” in 21st IEEE International Conference on Micro Electro Mechanical Systems (MEMS-2008), pp. 343-346, 13-17 Jan. 2008. 

[C3] Fei Wang, Xinxin Li, and Songlin Feng, “MEMS cantilever type probe card for IC testing,” in 9th Annual Domestic Conference of China Society of Micro-Nano Technology, Shanghai, accepted as the Best Student Paper out of 450 participants, Oral Presentation, 20-22 Sept. 2007. (In Chinese) 

[P1] Xinxin Li, Fei Wang, Fabrication of MEMS probe card with 2-Dimensional densely arrayed probe tips, China Patent. (ZL 2007 1 0038538.1). 

[P2] Xinxin Li, Fei Wang, Fabrication of MEMS probe card for wafer-level IC testing, China Patent. (ZL 2007 1 0173680.7)

RESEARCH PROJECTS:                                                                                 

[PI] 2014, start-up research grant for new faculty in SUSTC. 

[PI] 2010-2014, "Energy harvesting device with polymer electret for wireless electronic devices". Danish Research Council for Technology and Production (FTP), Denmark, 3,866,400 DKK. (Project No. 10-080864). 

[Co-PI] 2010-2014, "Microwatt Radio for Self-Sustaining Wireless Sensor Networks". Danish Research Council for Technology and Production (FTP), Denmark. (Project No. 10-093783)

Other Info:

There are a few positions opened at different levels as Research fellows, Research Assistants and Engineers in our group. We also welcome any visiting scholars or exchange students from the world. Please feel free to contact us if you are interested. 

Contacts:

◆ Department of Electronic and Electrical Engineering, South University of Science and Technology of China, Tangchang Road, Nanshan District, Shenzhen, P.R. China 518055

◆ Tel : +86-755-88O185O9

◆ Email:wang.f AT sustc.edu.cn

Research Fields

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